Powerful 32bit design based on unique integrated RISC/DSP core architecture from Hyperstone
Hyundai Electronics, one of the world’s largest DRAM manufacturers, is entering the market for embedded systems products with the launch of a range of powerful new RISC/DSP microcontroller designs. The GMS30C2216/32 family represents a new class of embedded microprocessor aimed particularly at applications requiring a fast, integrated solution capable of handling both digital and analog signals such as DVDs, FLASH cards, digital cameras, PDAs and similar consumer and multimedia electronic systems. Based on an innovative RISC/DSP architecture licensed from German silicon IP designer Hyperstone, the novel E1-32X core design combines a powerful 32bit RISC core with a 16/32bit Fixed Point DSP unit using a fully integrated instruction set to provide a unified programming model. A unique feature of the design is the 32bit wide 96-way register set which supports parallel operation of the ALU, DSP and load/store units, delivering the highest performance/power ratio – 2.4GOPS/Watt - of any comparable device. 8kByte of on-chip DRAM running at CPU clock speed provides a further performance boost. Operating at 108MHz, total power consumption is just 180mW at 3.3V. Extensive on-chip peripheral support includes DRAM controller,
software programmable PLL, 32bit timer, 3 serial I/O lines, interrupt controller and a 16/32bit bus
interface addressing 4GB of memory space. Two power-saving modes are implemented: power-down and sleep. Power-down halts instruction execution, whilst DRAM refresh and the internal timer are maintained. Sleep stops everything, drawing just 30uA until a wake-up signal is received.
“As part of a new strategy to target non-memory semiconductor business, Hyundai Electronics has chosen Hyperstone’s innovative RISC/DSP architecture to spearhead our entry into the embedded systems IC market,” stated Y.B Byon, Manager of MCU Marketing of Hyundai’s System IC business. “The unique combination of high performance, low power and integrated DSP capability offered by the E1-32X core design allows us to provide our customers with the best technical solution offering the fastest time-to-market in the widest range of embedded applications,” continued Mr. Byon. “We expect to build upon this relationship by bringing to market new and more powerful members of our GMS30C2xxx range, based on enhanced versions of Hyperstone’s E1-32X, before the end of this year.” “We are delighted that our system architecture has been chosen by Hyundai as a major element in their entry into the embedded microcontroller market,” stated Joachim Stinshoff, CEO of Hyperstone AG. “Both companies share a deep commitment to making available the most advanced technology to our respective customers and partners, and we believe this will form the basis of a long and fruitful relationship.” Text Ends
Notes for the Editor
Hyperstone
Hyperstone Electronics is an electronic system design company, founded in 1990, in Konstanz, Germany. Staff members have up to 30 years experience in design, production, sales and marketing of computer systems and peripheral devices. Technical development takes place in Konstanz, with sales channel operating through Hyperstone's global network of distributors and representatives (US, Europe, Taiwan, Korea, Japan) serving more than 80 customers worldwide
The company also has a growing network of third party partners who are developing application programs and complete system solutions for the Hyperstone RISC/DSP technology. Leading Far East silicon foundries provide wafer-subcontracting services. Hyperstone has three major product areas: Unified RISC/DSP 16/32 processors, Flash memory card products, digital cameras, and embedded intelligent biometric devices. In addition to standard product sales Hyperstone licenses the 32 RISC/DSP Core IP. Key licensees are Hyundai in Korea and ART in Taiwan.
Hyundai ElectronicsTM
Hyundai Electronics Industries Co.,Ltd. is an industry leader in the development, manufacture, sales, marketing, and distribution of high-quality Semiconductors (including DRAM, SRAM, Flash Memory, and System IC devices), Telecommunications, and Liquid Crystal Displays. In addition, Hyundai Electronics Industries Co.,Ltd. is expanding its System IC business unit with leading technology and has added deep-submicron foundry services as part of a strategy to broaden its overall semiconductor presence and achieve its goal of leading the global semiconductor market. The Semiconductor Group of Hyundai Electronics Industries Co.,Ltd. is the world's largest DRAM supplier with eleven semiconductor manufacturing facilities around the globe, and production capacity of over 300,000 wafer starts per month. Based in Korea, Hyundai Electronics Industries Co.,Ltd. maintains development, manufacturing, sales and marketing facilities worldwide.
Editorial Contact:
Juergen Pintaske,
Marketbroad Communications,
11-15 Dix’s Field,
EXETER, EX1 1QA
United Kingdom
Tel: +44(0)1392-284800
Fax: +44(0)1392-422444
email:
juergen@marketbroad.com Sales/Technical Contact:
Dr. Matthias Steck, VP Marketing & Sales
Hyperstone AG
Line-Eid-Strasse 3
D-78467 Konstanz, Germany
Tel: +49 (0) 7531 – 980 30
Fax: +49 (0) 7531 – 517 25
Email:
msteck@hyperstone.de Website:
www.hyperstone-ag.com