F3 NAND Flash Memory Controller

Reliable NAND Flash Controller for Industrial Embedded Storage Solutions

F3 | NAND Flash Memory Controller

CF / PATA NAND Flash Memory Controller for Industrial Embedded Storage Solutions

The Hyperstone F3 NAND Flash Memory Controller together with flash specific firmware offers an easy-to-use turnkey platform for high endurance flash disks of various form factors and interface standards.

  • Patented superior wear leveling together with ECC ensuring highest reliability and endurance
  • Optimized 32 Bit RISC core, instruction set and firmware for flash handling
  • Dual channel Direct Flash Access unit (DFA) including sector buffers for interleaved operations
  • Most power efficient design together with additional power saving features
  • Smart and custom features possible by simple firmware upgrades
  • ASSP with no need for external voltage regulator, detector or diodes, only few capacitors or resistors need to be added to bill of materials
  • Turnkey solution including firmware, manufacturing kit, test and development hardware, and reference schematics for a CF card or 2.5” solid state disk, and testmetrix log files

Download F3 Product Flyer

Hyperstone F3 NAND Flash Memory Controller

Product Information

Target Application

  • High reliability & industrial CompactFlashTM Cards (CFC)
  • Solid State Disks (SSD)
  • IDE Disk-on-Modules (DoM)
  • Embedded Flash
  • Multi-Chip-Modules (MCM)
  • Multi-Chip-Package (MCP)
  • PCMCIA or ATA PC cards
  • Disk-on-Board



  • Sustained read up to 45 MB/s
  • Sustained write up to 30 MB/s with interleaving
  • Random read up to 35 MB/s
  • Random write up to 6 MB/s
  • Custom performance optimizations for specified file sizes possible
  • Data transfer rate to flash memories: up to 80 MB/s
  • Host data transfer rate in PIO mode 6 or MDMA mode 4 up to 25 MB/s
  • Host data transfer rate in UDMA mode 4 up to 66 MB/s

Host Interface & Compliance

  • Fully compliant to CompactFlashTM 3.0 and compatible to 4.1 specifications
  • Fast ATA host-to-buffer transfer rates supporting PIO mode 6, MDMA mode 4, UDMA mode 4 in True-IDE mode
  • PCMCIA specification version 2.1
  • Configurable as removable, hot swappable, and fixed drive
  • Memory mapped or I/O operation
  • Automatic sensing of PCMCIA or True-IDE mode
  • Four integrated 512 Byte sector buffers and 256 Byte PCMCIA attribute memory
  • PCMCIA configuration option register, card configuration and status register
    and pin replacement register support

Controller & CPU

  • High performance 32-Bit Hyperstone RISC microprocessor architecture
  • 10 MHz to 70MHz clock frequency using adjustable internal oscillator
  • 16 KB internal Boot ROM
  • 20 KB internal SRAM
  • Card operation current 75 mA max.
  • Automatic power-down during wait periods, power saving mode
    incl. automatic wake-up and sleep mode with Icc < 100 µA
  • Supply voltage 5.0V ±10 % or 3.3V ±10%
  • On-chip voltage regulator for 3.3V flash memory power supply
  • On-chip voltage regulator for 2.5V processor core power supply
  • Internal voltage detector

Flash Memory & Interface Handling

  • Dual channel direct flash memory access (DFA)
  • Supporting all control signals for NAND type flash memory connection
  • Supporting direct connection of up to 16 flash memory chips
    enables (CE) - eight per channel
  • Flash memory power down logic and flash memory write protect control
  • Error Correcting Code (ECC) capable of correcting 4 symbols
    in a 512 Bytes sector with additional CRC
  • Firmware storage in flash memory
  • Firmware is loaded into internal memory by the boot ROM
  • Flash management including mapping of logical block addresses (LBA)
    to corresponding physical block addresses (PBA)
  • Bad Block Management
  • Wear leveling
  • Power Loss Protection
  • Interleaving, cache, and multi-plane programming

Order Information

  • F3-ILCT05 (TQFP 100, 8 CEs, RoHS, -40 to +85 °C)
  • F3-LCT05 (TQFP 100, 8 CEs, RoHS, 0 to +85 °C)
  • F3-ILCT06 (TQFP 128, 16 CEs, RoHS, -40 to +85 °C)
  • F3-ILCB06 (BGA 124, 16 CEs, RoHS, -40 to +85 °C)
  • F3-0BBD0 (KGD / Wafer, 16 CEs)

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