S6 | SD & MMC NAND Flash Controller

SD & MMC Controller for industrial and reliable NAND Flash Storage Solutions

SD & MMC Controller | S6 NAND Flash Memory Controller

Reliable SD, microSD & MMC NAND Flash Controller for SD cards, MMCs, DoB and eSD storage systems

The Hyperstone S6 NAND Flash Controller offers an easy-to-use turnkey platform for highly reliable flash solutions compliant to MMC4.2 and SD 2.0 interfaces.

  • Patented wear leveling together with ECC ensuring highest reliability and endurance
  • Optimized 32-Bit RISC core, instruction set, and firmware for flash handling
  • Dual channel Direct Flash Access unit (DFA) for interleaved operations
  • Large sector buffers for highest MLC performance
  • Most power efficient design together with power saving features
  • Smart and custom features possible by simple firmware upgrades
  • Additional UART to connect external devices such as security controllers
  • ASSP with no need for external voltage regulators, detectors or diodes
  • Exceptional power loss protection also with MLC flash through optimized firmware handling
  • Turnkey solution including firmware, manufacturing kit, test and development hardware, and reference schematics for SD Card or MMC

Download S6 Product Flyer

Hyperstone S6 NAND Flash Memory Controller

Product Information

Target Application

  • SecureDigitialTM - SD Cards for industrial and consumer applications
  • microSD cards for consumer and mobile applications
  • MultiMediaCardsTM (MMC)
  • eMMC embedded flash
  • Multi-Chip-Packages (MCP)
  • SmartCards

Performance

  • 2 times 4KB large page buffers per channel achieving optimal performance for SLC and MLC flash chips with 4KB page size
  • Sustained read and write up to 24 and 23 MB/s respectively using SLC in SD mode
  • Sustained read and write up to 22 and 9 MB/s respectively using MLC in SD mode
  • Sustained read and write up to 42 and 25 MB/s respectively using SLC in MMC mode
  • Sustained read and write up to 42 and 9 MB/s respectively using MLC in MMC mode
  • Data transfer rate to flash-memory of up to 40MB/s per channel

Host Interface & Compliance

  • Fully compliant to the SD 1.01, 1.10 and 2.0 (SDHC) standards
  • Fully compliant to MMC 3.31, 4.1 and 4.2 standards
  • Additional General Purpose UART and optional ISO 7816-3 interface

Controller & CPU

  • High performance 32-Bit Hyperstone RISC microprocessor
  • 10 to 60 MHz clock frequency using adjustable internal oscillator
  • 16 KB internal Boot ROM
  • 20 KB internal RAM
  • Card operation current of less than 25 mA
  • Automatic power-down mode during wait periods, power saving mode incl. automatic wake-up and sleep mode with Icc < 120 µA
  • Dual supply voltage 1.8V and 3.3V
  • On-chip voltage regulator for 1.8V and charge pump for 3.0V flash memory power supply
  • On-chip voltage regulator for 1.8V processor core supply
  • Internal voltage detector
  • Optimized die size, shape and pad layout for multi die packages and die stacking

Flash Memory & Interface Handling

  • Dual channel direct flash memory access (DFA)
  • Supporting all control signal for NAND type flash memory connection
  • Supporting direct connection of up to 4 flash memory chip enables (CE) - 2 per channel
  • 2 times 4KB large page buffers per channel achieving optimal performance for SLC and MLC flash chips with 4KB page size
  • Flash memory power down logic and flash memory write protect control
  • Error Correcting Code (ECC) capable of correcting 4 symbols in a 512 Bytes sector with additional CRC
  • Supporting all current and future vendor flashes and technologies (NAND, AG-AND, MLC/SLC, NROM, ...) by firmware upgrades
  • Firmware storage in flash memory
  • Firmware is loaded into internal memory by the boot ROM
  • Flash management including mapping of logical block addresses (LBA) to corresponding physical block addresses (PBA)
  • Bad Block Management
  • Wear leveling
  • Power Loss Protection
  • Interleaving, cache, and multi-plane programming

Order Information

  • S6-LAK05 (LGA 54, 7.5 x 4.0 x 0.7mm, RoHS, -25 to +85 °C)
  • S6-0ABD0 (Tested Die / Wafer

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