Hyperstone U9 USB 3.1

U9 - USB 3.1 Flash Memory Controller

The Hyperstone U9 family of Flash Memory Controllers together with provided firmware offers an easy-to-use turnkey solution for industrial, high endurance, and robust Flash Memory drives or modules compatible to host systems with USB 3.1 SuperSpeed 5 Gbps interface.

  • Designed to fully satisfy industrial requirements and feature requirements
  • hyReliability™ Flash Management including superior wear leveling, read disturb management, and power fail management ensuring highest reliability and durability
  • hyMap® Flash Translation Layer and mapping offering second to none random write performance, minimal write amplification, and consequently highest endurance for random access heavy usage profiles (e.g. JEDEC Enterprise)
  • Flexible 96-Bit/1K BCH ECC engine supporting all Flash Memory requirements
  • Optimized 32-Bit RISC core, instruction set for Flash Memory handling
  • Continuously updated Flash Memory chip support and long term availability
  • High performance on-the-fly AES 128 and 256 encryption engine
  • Custom features can be implemented with simple firmware upgrades
  • Turnkey solution including firmware, manufacturing kit, test and development hardware, as well as reference schematics
  • 16 GPIOs for customer specific applications supporting SPI, I2C and ISO7816 or additional flash CE
  • Application Programming Interface (API) and Software Development Kit (SDK) to develop own Custom Firmware Extensions (CFE)
  • Built-in temperature sensing capability
Block Diagram Hyperstone U9

Target Application

  • Industrial USB Flash Drive
  • eUSB, embedded USB module
  • Ultra durable Flash Drive
  • Security Flash Drive
  • Multi-Chip-Package (MCP)
  • Disk-on-Board

Order Information

  • U9-RBB06 --- TFBGA-124, 9x9x1.2mm, 8 CEs, RoHS, -40 to +85 °C (tape-and-reel)
  • U9-RBB06-Y --- TFBGA-124, 9x9x1.2mm, 8 CEs, RoHS, -40 to +85 °C (tray)
  • U9-0BBD0 --- Tested Die / Wafer
 

Controller & CPU

  • High performance 32-Bit Hyperstone RISC microprocessor
  • Large internal RAM provides firmware flexibility
  • 16 GPIO pins for customer specific applications, multiplexed interface options include: 16 GPIO, SPI, I2C, 8x CE and ISO7816
  • NTC thermistor interface and ADC for high accuracy temperature logging and optimized read/write operations
  • Unique ID for security applications
  • AES-128 and AES-256 support with CBC and XTS modes, high performance on-the-fly encryption/decryption
  • Hardware RNG
  • Flexible clock frequency generation through internal oscillator and PLL
  • Automatic power-down mode during wait periods for host data or Flash Memory operation completion, automatic sleep mode during host inactivity periods
  • On-chip switching voltage regulator for 1.2V controller core power
  • Supply voltage 3.3V ± 5%
  • Application Programming Interface (API) and Software Development Kit (SDK)

Performance

  • Fully compliant with USB 3.1 Gen 1 specifications
  • USB mass storage device class (MSC)
  • USB Attached SCSI (UASP) support
  • SuperSpeed, High-Speed, Full-Speed
  • Host transfer rate of up to 5 Gbps
  • Sequential read up to 200 MB/s
  • Sequential write up to 150 MB/s
  • Sustained 4K random write over 5 MB/s
  • Secure Erase and Sanitize support
  • S.M.A.R.T. and health monitoring
  • -40 to +85 °C industrial grade version
 

Host Interface & Compliance

  • Compliant to USB 3.1 Gen1
  • USB mass storage device class (MSC)
  • USB human interface device class (HID) support is possible
  • 4 configurable endpoints
  • Supporting Full-Speed, Hi-Speed and SuperSpeed 5Gbps transmissions
  • Bulk, isochronous, and interrupt transfer modes
  • USB Attached SCSI (UASP) support
  • S.M.A.R.T. Sanitize, and Secure Erase support using ATA pass through command
  • Configurable Early-Acknowledge to avoid any data loss during power fail

Flash Memory & Interface Handling

  • Direct Flash Memory Access (DFA) co-processor incl. page buffers and interleaving capability
  • DDR interface compliant with Toggle DDR and ONFI 2.3, compatible with all DDR Flash Memory devices
  • Asynchronous SDR interface, ONFI 1.0 compliant compatible with all legacy interface Flashes
  • 2-Channels with data transfer rate to Flash up to 200 MB/s each
  • Flexible 96-Bit/1K BCH ECC engine supporting all Flashes
  • CRC for additional reliability
  • Direct connection of up to 8 Flash Memory chip enables (CE)
  • Flash Memory power down logic and write protect control
  • Supporting all Flash technologies and all page sizes up to 16KB
  • On-chip voltage regulator for 1.8V Flash Memory I/O power

Flash Memory Management

  • hyReliability™ Flash Memory Management optimizing reliability, power fail safety, endurance, data retention, and performance
  • hyMap® Flash Translation Layer offering class-leading random write performance, minimal write amplification, and highest endurance for random usage profiles (e.g. JEDEC Enterprise)
  • Complete Flash Translation Layer (FTL) for random Flash data access including mapping of logical block addresses (LBA) to physical block addresses (PBA)
  • Bad Block Management
  • Static, Dynamic and Global Wear leveling to maximize write endurance
  • Intelligent garbage collection
  • Read Disturb Management, dynamic data refresh to maximize data retention and refresh data subject to read disturbance
  • Management of sudden power-fails
  • Interleaving, cache, and multi-plane programming
  • Firmware is stored redundantly for recovery and refresh
  • In-Field Firmware update without user data loss
  • Customized firmware, optimizations and feature implementations possible upon request.