Embedded MultiMedia Card

eMMC – BGA System-in-Package embedded Flash disk

eMMC is a System-in-Package (SiP) solution containing both Flash memory and a controller in a solderable package (BGA). eMMC exists in 100-, 153- and 169-ball BGA packages. It is very popular in compact systems like cell phones, where space is an issue. eMMC is based on an 8-bit parallel interface. Its main drawback is also its main advantage, which is that it can be soldered directly to the PCB. In the event of an issue with its memory, controller or firmware, the entire PCB would need to be replaced, creating significant cost in terms of spare parts and repair. It should also be noted that the temperature stress from soldering may impact the data quality on the Flash.

The eMMC standard has seen many revisions within the last years. In most industrial applications, endurance, ruggedness and long-term availability are prioritized; hence older revisions are still widely used. Another aspect important to industrial applications is the control over a fixed bill of materials (BOM), which sometimes makes Disk-on-Board (where controller and Flash are separately integrated) a viable alternative to eMMC.

eMMC 4.41 Controller

S8 Flash Memory Controller

The Hyperstone S8 family of Flash Memory Controllers together with provided application and Flash specific firmware offers an easy-to-use turnkey platform for industrial high endurance robust Flash Memory Cards or modules compatible to host systems with (e)SD or (e)MMC interfaces.

  • Designed to satisfy industrial requirements
  • hyReliability™ Flash Management including superior wear leveling, read disturb management, and power fail management ensuring highest reliability and endurance
  • Continuously updated Flash Memory chip support and long term availability
  • Flexible ECC engine supporting all Flash Memory handling
  • High performance on-the-fly AES encryption engine 
  • Custom features can be implemented with simple firmware upgrades
  • 16 GPIO for customer specific applications supporting SDIO 3.0, SPI, I2C, and ISO7816
  • ASSP with minimal external active components
  • Turnkey solution including firmware, manufacturing kit, test and development hardware, as well as reference schematics
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Konstanz, Germany


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