Hyperstone announces X1 - Low-Power SSD Controller for 3D Flash

Hyperstone announces X1 - Low-Power SSD Controller for 3D Flash

X1 - Low-Power SSD Controller for 3D Flash

New NAND flash controller offers high reliability and security for industrial solid state drives (SSDs), M.2, U.2, CFast and embedded flash drives (eSSDs).

Konstanz, Germany, 12 February 2019 – Today, Hyperstone introduces its new X1 – SATA III SSD controller. The X1 is targeting industrial and high-reliability SSDs, M.2 and U.2 modules, CFast cards and system-in-package eSSDs. In conjunction with Hyperstone’s hyMap® Flash Translation Layer (FTL), the new FlashXE® eXtended Endurance and hyReliability™ features, the X1 guarantees low power consumption, superior power-fail robustness and the highest reliability as well as comprehensive security features.

Product highlights:

  • Designed to fully satisfy industrial requirements
  • hyMap® sub-page-based flash translation layer: unparalleled random write performance, minimal write amplification and highest endurance without external DRAM
  • FlashXE® eXtended Endurance read-channel including calibration and error correction (ECC) with soft-decoding
  • hyReliability™ flash management: superior wear leveling, read-disturb management and power-fail management
  • Wide flash support: SLC, pSLC, 3D MLC, 3D TLC and next-generation NAND flashes
  • Advanced protection against radiation and soft errors including end-to-end datapath protection, SRAM ECC and low-alpha package
  • Up to 550 MB/s transfer speed
  • Low power consumption
  • Comprehensive health-monitoring data and lifetime estimation tools
  • Suited to M.2, U.2, 2.5-inch and 1.8-inch SSDs, CFast cards and embedded flash drives (eSSDs) or discrete on-board flash drive integration

The X1 is the latest addition to Hyperstone’s portfolio of NAND flash controllers enabling industrial customers to benefit from the most reliable and most energy efficient solid-state drive solution. “The powerful dual-core processor along with end-to-end datapath protection, SRAM ECC and FlashXE® are vital in guaranteeing an industrial reliable system with today’s 3D flashes” said Sandro-Diego Wölfle, Product Manager of Hyperstone. “Furthermore, the X1 provides extremely low power consumption, and as the silicon is designed for 125°C junction temperature, it can be used in 105 °C environments.”

The X1 will initially be available in 144-ball TFBGA (10.4 x 10.4 x 1.1 mm) and 124-ball TFBGA (9 x 9 x 1.2 mm) packages, qualified for the industrial temperature range (-40 to +85 °C). Mass-production samples and released firmware are available now. For more information download the product flyer available on the website today.

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