Embedded MultiMedia Card

eMMC – BGA System-in-Package embedded Flash disk

eMMC is a System-in-Package (SiP) solution containing both Flash memory and a controller in a solderable package (BGA). eMMC exists in 100-, 153- and 169-ball BGA packages. It is very popular in compact systems like cell phones, where space is an issue. eMMC is based on an 8-bit parallel interface. Its main drawback is also its main advantage, which is that it can be soldered directly to the PCB. In the event of an issue with its memory, controller or firmware, the entire PCB would need to be replaced, creating significant cost in terms of spare parts and repair. It should also be noted that the temperature stress from soldering may impact the data quality on the Flash.

The eMMC standard has seen many revisions within the last years. In most industrial applications, endurance, ruggedness and long-term availability are prioritized; hence older revisions are still widely used. Another aspect important to industrial applications is the control over a fixed bill of materials (BOM), which sometimes makes Disk-on-Board (where controller and Flash are separately integrated) a viable alternative to eMMC.

eMMC 4.41 Controller

S8 Flash Memory Controller


  • 滿足工業級要求的設計
  • 包括高級的均衡損秏,資料讀取抗干擾管理和掉電管理在內的hyReliability™快閃記憶體管理確保最高等級的穩定性和耐久度
  • 支援持續更新的快閃記憶體晶片和可長期獲得的快閃記憶體晶片
  • 靈活的糾錯編碼機制支援各種快閃記憶體的需求
  • 即時高性能的AES加密機制 
  • 通過固件升級提供客戶個性化的產品特徵
  • 16個通用輸入輸出管腳支援基於SDIO3.0, SPI,I2C和ISO7816介面的客制化應用
  • 使用最少週邊器件的專用標準產品
  • 包括固件,生產元件,測試和開發硬體,參考圖在內的一體化方案
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